Home
About Us
Company Profile
Join Us
Product
ADI
ST
TI
NXP
XILNX
ON
Applications
Car chip
Smart Appliances
Internet
Medical Instruments
Security
Network Communication
Industrial Automation
LED Lighting
Switching Mode Power Supply
News
Company News
Industry Dynamics
Contact
CN
Language selection
ENGLISH
CHINESE
Products
ADI
ST
TI
NXP
XILNX
ON
Solution
Car chip
Smart Appliances
Internet
Medical Instruments
Security
Network Communication
Industrial Automation
LED Lighting
Switching Mode Power Supply
News
Company News
Industry Dynamics
About Us
Company Profile
Join Us
Contact Us
products
Current Location:
Home
>
Products
>
ADI
Products
Products
ADI
ST
TI
NXP
XILNX
ON
显示数量
30
20
30
50
Package
-
100-BCQFP
100-BQFP
100-FBGA, CSPBGA
100-LFBGA, CSPBGA
100-LQFP
100-TQFP Exposed Pad
105-LFBGA, CSPBGA
10-CFlatPack
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
10-VFDFN Exposed Pad, CSP
10-WFDFN Exposed Pad
10-WFDFN Exposed Pad, CSP
119-BBGA
128-BQFP
12-TSSOP (0.118, 3.00mm Width)
12-WFDFN Exposed Pad
13-SIP, 4 Leads, Offset Leads
140-BFBGA
144-LFBGA, CSPBGA
14-CDIP (0.300, 7.62mm)
14-SOIC (0.154, 3.90mm Width)
14-TSSOP (0.173, 4.40mm Width)
14-WFDFN Exposed Pad
160-BQFP
16-CDIP (0.300, 7.62mm)
16-DIP (0.300, 7.62mm)
16-SOIC (0.154, 3.90mm Width)
16-SOIC (0.295, 7.50mm Width)
16-SSOP (0.154, 3.90mm Width)
16-TFSOP (0.118, 3.00mm Width)
16-TFSOP (0.118, 3.00mm Width) Exposed Pad
16-TSSOP (0.173, 4.40mm Width)
16-UFBGA, WLCSP
16-VFCQFN Exposed Pad
16-VFQFN Exposed Pad
16-VFQFN Exposed Pad, CSP
16-WFDFN Exposed Pad
16-WFQFN Exposed Pad, CSP
16-WFQFN, CSP
16-WQFN Exposed Pad, CSP
17-UFBGA, WLCSP
18-CDIP
18-CDIP (0.300, 7.62mm)
18-DIP (0.300, 7.62mm)
18-SOIC (0.295, 7.50mm Width)
18-WQFN Exposed Pad, CSP
192-LFBGA Exposed Pad
196-LFBGA Exposed Pad
20-CDIP (0.300, 7.62mm)
20-CLCC
20-DIP (0.300, 7.62mm)
20-LCC (J-Lead)
20-SOIC (0.295, 7.50mm Width)
20-SSOP (0.154, 3.90mm Width)
20-SSOP (0.209, 5.30mm Width)
20-TFLGA
20-TSSOP (0.173, 4.40mm Width)
20-UFBGA, WLCSP
20-VFQFN Exposed Pad, CSP
20-WFQFN Exposed Pad, CSP
221-BFBGA
24-CDIP (0.300, 7.62mm)
24-DIP (0.300, 7.62mm)
24-DIP (0.400, 10.16mm)
24-DIP (0.500, 12.70mm), 4 Leads
24-DIP (0.600, 15.24mm)
24-FLGA
24-SOIC (0.295, 7.50mm Width)
24-SSOP (0.154, 3.90mm Width)
24-SSOP (0.209, 5.30mm Width)
24-TFCQFN Exposed Pad
24-TSSOP (0.173, 4.40mm Width)
24-UFQFN Exposed Pad, CSP
24-VFQFN Exposed Pad
24-VFQFN Exposed Pad, CSP
24-WFDFN Exposed Pad
24-WFQFN Exposed Pad
24-WFQFN Exposed Pad, CSP
256-BGA, CSPBGA
256-LBGA Exposed Pad
25-UFBGA, WLCSP
28-CDIP (0.600, 15.24mm)
28-CDIP (0.605, 15.37mm)
28-CDIP (0.605, 15.37mm) and 32-CDIP (0.900, 22.86mm)
28-CLCC
28-DIP (0.600, 15.24mm)
28-LCC
28-LCC (J-Lead)
28-SOIC (0.295, 7.50mm Width)
28-SSOP (0.154, 3.90mm Width)
28-SSOP (0.209, 5.30mm Width)
28-TSSOP (0.173, 4.40mm Width)
28-VFQFN Exposed Pad
28-WFQFN Exposed Pad
28-WFQFN Exposed Pad, CSP
324-FBGA Exposed Pad
32-CDIP (0.600, 15.24mm)
32-CDIP (0.900, 22.86mm)
32-CDIP (0.900, 22.86mm) and 32-CDIP (0.910, 23.12mm)
32-CDIP (0.900, 22.90mm)
32-CDIP (0.910, 23.12mm)
32-CDIP Module
32-DIP (0.900, 22.90mm)
32-LQFP
32-QFP
32-TFCQFN Exposed Pad
32-TQFP
32-VFQFN Exposed Pad
32-VFQFN Exposed Pad, CSP
32-WFQFN Exposed Pad
32-WFQFN Exposed Pad, CSP
35-UFBGA, WLCSP
36-SSOP (0.209, 5.30mm Width)
36-UFBGA, WLCSP
36-WFQFN Exposed Pad
38-WFQFN Exposed Pad
40-CDIP (0.600, 15.24mm)
40-CDIP (0.900, 22.86mm)
40-CFlatPack
40-VFQFN Exposed Pad
40-VFQFN Exposed Pad, CSP
40-WFQFN Exposed Pad
40-WFQFN Exposed Pad, CSP
42-UFBGA, WLCSP
44-CLCC
44-CLCC (J-Lead)
44-LCC (J-Lead)
44-LQFP
44-QFP
44-TQFP
46-DIP (1.295, 32.89mm)
46-DIP Module
48-CDIP (0.600, 15.24mm)
48-LQFP
48-TFLGA Exposed Pad
48-TFSOP (0.240, 6.10mm Width)
48-VFLGA Exposed Pad
48-VFQFN Exposed Pad
48-VFQFN Exposed Pad, CSP
48-WFQFN Exposed Pad
48-WFQFN Exposed Pad, CSP
49-FBGA, CSPBGA
52-LQFP
52-QFP
52-TQFP Exposed Pad
52-WFQFN Exposed Pad
56-UFBGA, WLCSP
56-VFQFN Exposed Pad, CSP
56-VTLA Exposed Pad
56-WFQFN Exposed Pad
56-WFQFN Exposed Pad, CSP
64-FBGA, CSPBGA
64-LFBGA, CSPBGA
64-LQFP
64-TQFP
64-TQFP Exposed Pad
64-VFQFN Exposed Pad, CSP
64-WFQFN Exposed Pad
64-WFQFN Exposed Pad, CSP
68-CLCC
68-VFQFN Exposed Pad, CSP
6-TSSOP, SC-88, SOT-363
6-WFDFN Exposed Pad
72-FBGA, CSPBGA
72-VFQFN Exposed Pad, CSP
80-LFBGA, CSPBGA
80-LQFP
80-TQFP Exposed Pad
88-VFQFN Exposed Pad, CSP
8-CDIP (0.300, 7.62mm)
8-DIP (0.300, 7.62mm)
8-SOIC (0.154, 3.90mm Width)
8-SOIC (0.295, 7.50mm Width)
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
8-UFBGA, WLCSP
8-UFDFN Exposed Pad, CSP
8-VDFN Exposed Pad, CSP
8-WFDFN Exposed Pad
9-UFBGA, WLCSP
Die
Module
SOT-23-5 Thin, TSOT-23-5
SOT-23-6
SOT-23-6 Thin, TSOT-23-6
SOT-23-8
SOT-23-8 Thin, TSOT-23-8
全部重置
应用筛选
筛选结果:
/
综合排序
库存
价格
符合条件商品:
5000
价格筛选(小批量):
-
现货商品
Part Number
库存
文件上传
Package
QQ
Tel
+8613428794333
Contact Us
Wechat
GOTOP